Plastic Enclosures: Materials, Applications, and Environmental Implications in Modern Electronics and Packaging

2026 Open access

Read full text
Authors: Joydeep Dey, Priyanshu Das
DOI: 10.13140/rg.2.2.29913.79204
Cited by: 0

Fields of Study & Subjects

Material Selection and Properties Recycling and Waste Management Techniques Electronic Packaging and Soldering Technologies

Publication details

Publication date
1 January 2026