A 256 Gb/s DWDM Optical I/O in a 3D-stacked EIC/PIC Silicon Photonics Platform

Optical Fiber Communication Conference (OFC) 2026 2026

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Authors: Nandish Mehta, Angad Rekhi, Nikola Nedović, Sanquan Song, Benjamin G. Lee, Georgios Kalogerakis, Li Xu, Brian Zimmer, Steve Tell, Yoshi Nishi, Xi Chen, Ward Lopes
+2 more Trey Greer, Tom Gray
DOI: 10.1364/ofc.2026.m4b.2
Cited by: 1

Abstract

We present an (8+1)×32 Gb/s/λ DWDM optical I/O comprising eight data and one bandpass-filtered forwarded-clock lane in a 3D-stacked 7 nm EIC/65 nm PIC Silicon-photonics platform. It achieves 7.14×10 -14 BER and 1.33Tb/s/mm 2 areal bandwidth density.

Fields of Study & Subjects

Photonic and Optical Devices Optical Network Technologies Semiconductor Lasers and Optical Devices

Publication details

Journal / source
Optical Fiber Communication Conference (OFC) 2026
Publisher
Optica Publishing Group
Pages
M4B.2–M4B.2
Publication date
1 January 2026