Rapid prototyping of laser-integrated silicon photonic circuits using wafer-scale photonic wire bonding

This work explores a scalable co-packaging process for rapid prototyping of semiconductor laser-integrated photonic circuits using photonic wire bonding (PWB), targeting portable and stable optical biosensing systems. As a pilot demonstration of wafer-scale PWB laser integration, the process — comprising deep-trench die bonding, electrical interconnects, PWB-based optical coupling, and stealth dicing — was implemented on a 100-mm SOI wafer integrating 101 known-good-die lasers. A PWB development yield of 93.3% and a cumulative optical measurement yield of 68.3% were achieved, with yield losses dominated by fabrication, assembly, and circuit-level effects rather than the PWB process itself. Resonator circuits characterized via on-chip laser current tuning exhibited average quality factors of ~2x10^5, free spectral ranges of ~100 pm, drift rates of 0.02 pm/min, and sub-picometer stability, comparable to commercial swept-tunable laser systems, supporting decentralized biosensing with photonic integrated circuits.