Test Method for Presence of Foreign Matter on Printed Wiring Board Contacts

2026

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Authors: B02 Committee
DOI: 10.1520/b0885-09r26
Cited by: 0

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies Electrical Contact Performance and Analysis Industrial Vision Systems and Defect Detection

Publication details

Publication date
1 February 2026
Language
EN