Optical Profilometer Dataset for Diced Surfaces Obtained with Wafer Dicing Machine at Varying Feed Velocities
Abstract
Fused silica wafers (1mm thickness) were diced with a wafer dicing machine (Disco DAD3350) at different feed velocities to analyze the impact on the surface roughness. The surface roughness was measured with an optical profilometer (Keyence VK-X3000) in white light interferometer mode. Raw data from the interferometer measurements and a README file are included in this dataset.
Fields of Study & Subjects
Advanced machining processes and optimization
Advanced Surface Polishing Techniques
Surface Roughness and Optical Measurements
Publication details
- Publication date
- 29 January 2026
- Language
- EN
- Document type
- Dataset