Mechanical and electrical properties of copper oxide thin films formed by thermal oxidation
Fields of Study & Subjects
Copper-based nanomaterials and applications
Dielectric properties of ceramics
Copper Interconnects and Reliability
Publication details
- Journal / source
- Journal of materials research/Pratt's guide to venture capital sources
- Publisher
- Springer Science and Business Media LLC
- Volume
- 41
- Issue
- 5
- Pages
- 866–880
- Publication date
- 12 February 2026
- Language
- EN