Thermal analysis of 3D GPU-memory architectures with boron nitride interposer

MRS Communications 2026

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Authors: Eric Han Wang, Weijia Yan, Ruihong Huang

DOI: 10.1557/s43579-025-00913-8

Cited by: 3

References: 28

Fields of Study & Subjects

Thermal properties of materials 3D IC and TSV technologies Silicon and Solar Cell Technologies

References 28