Temperature dependent analysis of multiwall carbon nanotubes TSVs in 3D integrated circuits

MRS Communications 2026

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Authors: Chun-Wei Yao, Ming-Han Liao, Jiang Zhou, Xuejun Fan, Stephen Jones

DOI: 10.1557/s43579-026-00927-w

Cited by: 0

References: 30

Fields of Study & Subjects

3D IC and TSV technologies Advancements in Semiconductor Devices and Circuit Design Advanced MEMS and NEMS Technologies

References 30