Role of vacancies and silicon doping in modulating the electrical transport of metal interconnects

MRS Communications 2026

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Authors: Jiamiao Yang, Shunbo Hu

DOI: 10.1557/s43579-026-00947-6

Cited by: 0

References: 28

Fields of Study & Subjects

Copper Interconnects and Reliability Semiconductor materials and interfaces Semiconductor materials and devices

References 28