Tailoring crystallinity in Al2O3 dielectric films via PEALD and sputtering: Implications for thermal budget and device integration
Fields of Study & Subjects
Semiconductor materials and devices
Copper Interconnects and Reliability
Ferroelectric and Piezoelectric Materials
Publication details
- Journal / source
- MRS Advances
- Publisher
- Springer Science and Business Media LLC
- Volume
- 11
- Issue
- 10
- Pages
- 1205–1215
- Publication date
- 20 April 2026
- Language
- EN