Insights into the Reliability of Advanced Glass Packages

IEEE RESOURCE CENTERS 2026 Open access

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Authors: Vanessa Smet
DOI: 10.17023/16m8-x876
Cited by: 0

Fields of Study & Subjects

Glass properties and applications Electronic Packaging and Soldering Technologies Semiconductor materials and devices

Publication details

Journal / source
IEEE RESOURCE CENTERS
Publication date
3 March 2026
Language
EN