Characterization and Modelling of Epoxy Mold Compounds for High-Voltage Integrated-Circuit Packages

IEEE RESOURCE CENTERS 2026 Open access

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Authors: Luigi Balestra
DOI: 10.17023/e1zb-3932
Cited by: 0

Fields of Study & Subjects

High voltage insulation and dielectric phenomena Electronic Packaging and Soldering Technologies Epoxy Resin Curing Processes

Publication details

Journal / source
IEEE RESOURCE CENTERS
Publication date
3 March 2026
Language
EN