Electromigration and Thermomigration Behavior of Cu Microbumps in Stacked Die Assembly

IEEE RESOURCE CENTERS 2026 Open access

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Authors: Shubhra Bansal

DOI: 10.17023/f40c-ve97

Cited by: 0

Fields of Study & Subjects

3D IC and TSV technologies Electronic Packaging and Soldering Technologies Copper Interconnects and Reliability