Reliability for Thermal Interface Materials

IEEE RESOURCE CENTERS 2026 Open access

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Authors: Amy Marie Marconnet
DOI: 10.17023/prz3-zq75
Cited by: 0

Fields of Study & Subjects

Thermal properties of materials Electronic Packaging and Soldering Technologies Silicon Carbide Semiconductor Technologies

Publication details

Journal / source
IEEE RESOURCE CENTERS
Publication date
3 March 2026
Language
EN