Electromigration Failure Caused by Interdiffusion between Al Trace and Cu Seed Layer in the Microbump in 3D IC

IEEE RESOURCE CENTERS 2026 Open access

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Authors: Yifan Yao

DOI: 10.17023/r54r-ac43

Cited by: 0

Fields of Study & Subjects

3D IC and TSV technologies Copper Interconnects and Reliability Electronic Packaging and Soldering Technologies