Mechanical Integrity of Hybrid Bonding

IEEE RESOURCE CENTERS 2026 Open access

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Authors: Oguzhan Orkut Okudur
DOI: 10.17023/twc3-3982
Cited by: 0

Fields of Study & Subjects

3D IC and TSV technologies Electronic Packaging and Soldering Technologies Copper Interconnects and Reliability

Publication details

Journal / source
IEEE RESOURCE CENTERS
Publication date
3 March 2026
Language
EN