Reliability Testing and Design for Reliability of Packaging Interconnects

IEEE RESOURCE CENTERS 2026 Open access

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Authors: John Hon-Shing Lau
DOI: 10.17023/x5g2-nz68
Cited by: 0

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies 3D IC and TSV technologies Copper Interconnects and Reliability

Publication details

Journal / source
IEEE RESOURCE CENTERS
Publication date
3 March 2026
Language
EN