Fault Isolation and Failure Analysis Challenges in Microelectronic Devices with Heterogeneous Integration: EDFAS FA Technology Roadmap Overview

IEEE RESOURCE CENTERS 2026 Open access

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Authors: Yan Li
DOI: 10.17023/yxyg-h062
Cited by: 0

Fields of Study & Subjects

Integrated Circuits and Semiconductor Failure Analysis VLSI and Analog Circuit Testing 3D IC and TSV technologies

Publication details

Journal / source
IEEE RESOURCE CENTERS
Publication date
3 March 2026
Language
EN