STL Data : Topology-optimized thermal cloaks for transient heat conduction

Mendeley Data 2026 Dataset Open access

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Authors: Garuda Fujii
DOI: 10.17632/pyfxbcdzr8
Cited by: 0

Abstract

STL data of optimal configurations of thermal cloak for transient heat conduction

Fields of Study & Subjects

Topology Optimization in Engineering Thermal Radiation and Cooling Technologies Metamaterials and Metasurfaces Applications

Publication details

Journal / source
Mendeley Data
Publication date
1 January 2026
Document type
Dataset