Progress and critical challenges in slicing of thin semiconductor wafers using ultra-fine diamond wire

Strathprints: The University of Strathclyde institutional repository (University of Strathclyde) 2026 Open access

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Authors: Ge, Peiqi, Cao, Zhecan, Li, Zongqiang, Wang, Peizhi, Bi, Wenbo, Ge, Mengran, Xie, Wenkun, Xing, Xu
DOI: 10.17868/strath.00094630
Cited by: 0

Abstract

Diamond wire sawing (DWS) has emerged as the dominant wafer slicing technology owing to its superior surface quality, reduced kerf loss, and high processing efficiency. To further reduce costs, the industry is pursuing thinner wafers (

Fields of Study & Subjects

Advanced Surface Polishing Techniques Advanced machining processes and optimization Tunneling and Rock Mechanics

Publication details

Journal / source
Strathprints: The University of Strathclyde institutional repository (University of Strathclyde)
Publication date
1 January 2026