Resolving the Thermal Bottleneck in 3D-ICs: A Ramanujan-Bhabha Quantum-Thermal Framework for Next-Gen VLSI

Research Square 2026 Preprint Open access

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Authors: S. Eshwar Rao
DOI: 10.21203/rs.3.rs-8472821/v1
Cited by: 0
References: 23

Fields of Study & Subjects

Thermal properties of materials Advancements in Semiconductor Devices and Circuit Design 3D IC and TSV technologies

Publication details

Journal / source
Research Square
Publication date
6 January 2026
Document type
Preprint