Effect of Ether Bond Number in Organic Solvents on the Corrosion Behavior of SnAg3.0Cu0.5 Solder Paste

Research Square 2026 Preprint Open access

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Authors: xin Wu, guangxing hu, wenjia jing, pengju xing, xiyu sun, lanxin jia
DOI: 10.21203/rs.3.rs-8692724/v1
Cited by: 0
References: 11

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies Corrosion Behavior and Inhibition Electrodeposition and Electroless Coatings

Publication details

Journal / source
Research Square
Publication date
4 February 2026
Document type
Preprint