Emerging Paradigms in Thermal Interface Materials:Metallic Nanostructure–Based Hybrid Architecture Chakravardhan 22(CV22)**
Fields of Study & Subjects
Thermal properties of materials
Electronic Packaging and Soldering Technologies
Phase Change Materials Research
Publication details
- Journal / source
- Research Square
- Publication date
- 10 February 2026
- Language
- EN
- Document type
- Preprint