Multi-Dimensional Performance Evaluation and Influencing Factors Study of Inter-chip Thermal Coupling in Immersion-Cooled Heterogeneous Multi-Chip Servers

SSRN Electronic Journal 2026 Preprint Open access

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Authors: Yang Lin, Chang Yue, Liping Zeng, Jing Ee Yit, Kamaruzzaman Kamaruzzaman Sopian, Wen Su, Jiaqiang Wang
DOI: 10.2139/ssrn.5999214
Cited by: 0
References: 24

Fields of Study & Subjects

Parallel Computing and Optimization Techniques Low-power high-performance VLSI design Heat Transfer and Optimization

Publication details

Journal / source
SSRN Electronic Journal
Publication date
1 January 2026
Document type
Preprint