The effect of diamond wafer on heat transfer enhancement for the copper heat sink with high heat flux: simulation research

SSRN Electronic Journal 2026 Preprint Open access

Read full text

Authors: zilong wang, Ming Liu, HaiTao Chen, Hua Zhang, Binlin Dou, tao yang, BiJia Li

DOI: 10.2139/ssrn.6018496

Cited by: 0

References: 18

Fields of Study & Subjects

Thermal properties of materials Heat Transfer and Optimization 3D IC and TSV technologies

References 18