Impact of Interfacial Nanostructures on Adhesive Bond Failure Investigated by In-Situ STEM under Tensile Loading

SSRN Electronic Journal 2026 Preprint Open access

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Authors: Shin Horiuchi, Kumiko Sunaga, Noriyuki Saito, Kazumasa Shimamoto, Pangpang Wang, Sunao Yamada

DOI: 10.2139/ssrn.6023534

Cited by: 0

References: 19

Fields of Study & Subjects

Mechanical Behavior of Composites Electronic Packaging and Soldering Technologies Fiber-reinforced polymer composites

References 19