Ultrathin W2N barrier enabling texture-engineered cobalt interconnects with enhanced electromigration reliability

SSRN Electronic Journal 2026 Preprint Open access

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Authors: Jau-Shiung Fang, Yu-Shun Chang, Yi-Lung Cheng, Chun-Wei Huang, Giin-Shan Chen

DOI: 10.2139/ssrn.6024566

Cited by: 0

References: 27

Fields of Study & Subjects

Copper Interconnects and Reliability Electronic Packaging and Soldering Technologies Metal and Thin Film Mechanics

References 27