Taming the Boundary Effect: Femtosecond Laser Processing of 4H-SiC Enabled by Side-Scribing for Low-Stress Slicing
Fields of Study & Subjects
Silicon Carbide Semiconductor Technologies
Laser Material Processing Techniques
Pulsed Power Technology Applications
Publication details
- Journal / source
- SSRN Electronic Journal
- Publication date
- 1 January 2026
- Document type
- Preprint