Unveiling the Mechanism of Nitrogen Plasma Activated Dielectric Oxides for Low Temperature Wafer-to-Wafer Bonding

SSRN Electronic Journal 2026 Preprint Open access

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Authors: Yaning Lin, Shangyu Lv, Xiangyang Shi, Rong Zeng, Xiaodan Li, Zhiwen Chen

DOI: 10.2139/ssrn.6049791

Cited by: 0

References: 36

Fields of Study & Subjects

3D IC and TSV technologies Copper Interconnects and Reliability Electronic Packaging and Soldering Technologies

References 36