Effects of wire bonding pressure and solder material on the reliability of TO-247 packaged SiC MOSFET under power cycling

SSRN Electronic Journal 2026 Preprint Open access

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Authors: Shoulai Gong, Fanpeng Zeng, Yingxin Cui, Kuan Yew Cheong, Yanao Guo, Jisheng Han

DOI: 10.2139/ssrn.6050502

Cited by: 0

References: 20

Fields of Study & Subjects

Silicon Carbide Semiconductor Technologies Electronic Packaging and Soldering Technologies Advanced ceramic materials synthesis

References 20