Analysis of the Impact of Structural Parameters on Natural Frequency, Random Vibration Stress, and Bending Stress in Stacked BGA Solder Joints Based on Orthogonal Experimental Design

SSRN Electronic Journal 2026 Preprint Open access

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Authors: D. K. Chen, Chunyue Huang, Jingcheng Mo, Chao Gao, Gui Ping Wang
DOI: 10.2139/ssrn.6056555
Cited by: 0
References: 6

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies Probabilistic and Robust Engineering Design Mechanical Engineering Research and Applications

Publication details

Journal / source
SSRN Electronic Journal
Publication date
1 January 2026
Document type
Preprint