Enhancing the Microstructure and Mechanical Properties of NiV/Cu Diffusion-Bonded Joints via a Magnetron-Sputtered Ni Interlayer

SSRN Electronic Journal 2026 Preprint Open access

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Authors: Jingyu Li, Jinghong Chen, Yunxiu Chao, Ming Wen, chengqi Shi, Yiqing Wang, Sixie Li, Chuanjun Wang
DOI: 10.2139/ssrn.6066720
Cited by: 0
References: 15

Fields of Study & Subjects

Advanced Welding Techniques Analysis Microstructure and mechanical properties Electronic Packaging and Soldering Technologies

Publication details

Journal / source
SSRN Electronic Journal
Publication date
1 January 2026
Document type
Preprint