Dual-Step Laser Ablation and Polishing for High-Quality Microgrooves in Low-k Wafer Dicing

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Authors: Youngchul Kwon, Hao Fu, Mohmammad Hohammadzadeh Sanandaji, Mohmammad Ikram Haider, Avik Samanta, Benxin Wu, Hongtao Ding
Cited by: 0
References: 16

Fields of Study & Subjects

Laser Material Processing Techniques Advanced Surface Polishing Techniques Advanced machining processes and optimization

Publication details

Journal / source
SSRN Electronic Journal
Publication date
1 January 2026
Document type
Preprint