Enhancing the Microstructure and Mechanical Properties of NiV/Cu Diffusion-Bonded Joints via a Magnetron-Sputtered Ni Interlayer
Fields of Study & Subjects
Advanced Welding Techniques Analysis
Electronic Packaging and Soldering Technologies
3D IC and TSV technologies
Publication details
- Journal / source
- SSRN Electronic Journal
- Publication date
- 1 January 2026
- Document type
- Preprint