Low Loss and High Efficiency Laser Slicing Method for 4H-SiC Based on Modified-Unit and Investigation of Crack Evolution
Fields of Study & Subjects
Silicon Carbide Semiconductor Technologies
Laser Material Processing Techniques
Advanced Surface Polishing Techniques
Publication details
- Journal / source
- SSRN Electronic Journal
- Publication date
- 1 January 2026
- Document type
- Preprint