Microstructure and properties of electromigration of pure Sn and Sn3.5Ag micro solder joints

SSRN Electronic Journal 2026 Preprint Open access

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Authors: Keke Zhang, Fupeng Huo, Shigeaki Uchida, Yanzhen Zhang, Zhu Liu, Haizhou Zhang, Wenjia Zhao, Hiroshi Nishikawa

DOI: 10.2139/ssrn.6149222

Cited by: 0

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies Copper Interconnects and Reliability Electrodeposition and Electroless Coatings