Pulse Periodic Reverse Electro-filling of Through-Glass Via and Shear Strength Reliability for MEMS Interposers

SSRN Electronic Journal 2026 Preprint Open access

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Authors: Chul-Hwa Jung, Ashutosh Sharma, Jae Pil Jung, Hyunsik Kim

DOI: 10.2139/ssrn.6151069

Cited by: 0

References: 21

Fields of Study & Subjects

3D IC and TSV technologies Electronic Packaging and Soldering Technologies Electrodeposition and Electroless Coatings

References 21