A New Tetragonal Cu20Bi9 Intermetallic Compound Discovered in Space-Solidified Cu-Sn-Bi Alloy

SSRN Electronic Journal 2026 Preprint Open access

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Authors: Qing Zhong, W.J. Xie
DOI: 10.2139/ssrn.6169113
Cited by: 0
References: 21

Fields of Study & Subjects

Intermetallics and Advanced Alloy Properties Metallurgical and Alloy Processes Quasicrystal Structures and Properties

Publication details

Journal / source
SSRN Electronic Journal
Publication date
1 January 2026
Document type
Preprint