Design and Chemically-Deposited Fabrication of Ternary-Metallic Conductive Powders with Multilayer and Core-Shell Structures

SSRN Electronic Journal 2026 Preprint Open access

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Authors: Xiaomei Dong, Xingyue Yong, Jiachen Wu, Bo Wang, Xianming Wang

DOI: 10.2139/ssrn.6175573

Cited by: 0

References: 52

Fields of Study & Subjects

Electrodeposition and Electroless Coatings Electronic Packaging and Soldering Technologies Powder Metallurgy Techniques and Materials

References 52