Effect of Ni Addition on the Comprehensive Properties of Bi-2.6Ag-xNi/Cu Solder Joints

SSRN Electronic Journal 2026 Preprint Open access

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Authors: Xuemei Li, Yupeng Su, Mingyu Qi, Rui Guo, Rui Fan, Hongyan Wang, Li Bao
DOI: 10.2139/ssrn.6194453
Cited by: 0
References: 21

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies Metallurgical and Alloy Processes Advanced Welding Techniques Analysis

Publication details

Journal / source
SSRN Electronic Journal
Publication date
1 January 2026
Document type
Preprint