Enhanced Thermal Conductivity in hBN Nanocomposites through Plasma-Etching-Induced Surface Roughness Alteration
Fields of Study & Subjects
Thermal properties of materials
Heat Transfer and Numerical Methods
Electronic Packaging and Soldering Technologies
Publication details
- Journal / source
- SSRN Electronic Journal
- Publication date
- 1 January 2026
- Language
- EN
- Document type
- Preprint