Thermal Behavior of a Microchannel Heat Sink with Water-Droplet-Grooved Cone-Column Channel: Inlet Velocity Variation

A microchannel heat sink is a microelectronic device that is mostly used as a small channel for heat dissipation through large electronic devices (such as mobile phones, computers, etc.) to improve their performance by preventing overheating. As the days pass, the utility of microchannel heat sinks is increasing. Due to the growing effects of global warming, it has become more crucial to find a better model to improve their thermal performance. This research introduces a new model of microchannel heat sink with a water-droplet-grooved cone-column channel and also a new type of ionanofluid (Sat (22%) ethylammonium nitrate (Sat EAN) as ionic liquid and boron nitrate as nanoparticle) to improve its thermal performance and analyze the effect of various parameters. The effect of various inlet velocities on the Nusselt number, pumping power, thermal resistance, friction factor, and pressure drop is analyzed, and it is found that the Nusselt number, pumping power, pressure drop, and friction factor are rising in accordance with the increasing Reynolds number, ranging from 20 to 1000. This statistic indicates the improvement in the convective heat transfer as a result of the enhanced fluid velocity of the system. While the increase in pumping power and pressure drop indicates that more energy is needed to overcome flow resistance, the rise in the Nusselt number indicates greater thermal performance. The system’s thermal resistance dramatically drops in spite of the increased input energy, which is a positive result. This decrease in thermal resistance suggests more effective heat dissipation, demonstrating how well the new design performs with the introduced ionanofluid to improve overall thermal performance.