Modal Analysis of Through-Silicon Vias via Rayleigh–Ritz Methods: A Foundation for Acoustic Non-Destructive Void Evaluation

SSRN Electronic Journal 2026 Preprint Open access

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Authors: G. A. Antonelli, Shiva Mudide

DOI: 10.2139/ssrn.6228349

Cited by: 0

References: 21

Fields of Study & Subjects

3D IC and TSV technologies Ultrasonics and Acoustic Wave Propagation Integrated Circuits and Semiconductor Failure Analysis

References 21