Impact of Surface Oxidation on SAC305 Solder Joint Reliability and Oxide Removal Rework Processes

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Authors: Taek-soo Shin, Jaejun Yoon, Minji Kim, Seongho Sim, Kyoungwook Kim, 구길호, Jihyun Lee, C. S. Lee, seung-boo jung
Cited by: 0
References: 31

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies Welding Techniques and Residual Stresses Electrodeposition and Electroless Coatings

Publication details

Journal / source
SSRN Electronic Journal
Publication date
1 January 2026
Language
EN
Document type
Preprint