Bonding Process and Mechanism of Polyimide Film to Copper via Polyamide-imide Adhesive

SSRN Electronic Journal 2026 Preprint Open access

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Authors: Ziming Hou, Ke Liu, Yanyu Song, Duo Liu, Xingyi Li, Tianxiao Zhu, Rui Tian, X.G. Song
DOI: 10.2139/ssrn.6257113
Cited by: 0

Fields of Study & Subjects

Synthesis and properties of polymers Electronic Packaging and Soldering Technologies 3D IC and TSV technologies

Publication details

Journal / source
SSRN Electronic Journal
Publication date
1 January 2026
Language
EN
Document type
Preprint