A Flip-Chip Bonded RF MEMS Contact Switch with Integrated Hermetic Sealing Using a Single-Crystal Silicon Cantilever

SSRN Electronic Journal 2026 Preprint Open access

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Authors: Liwei Jiang, Zirui Liu, Zheyao Wang

DOI: 10.2139/ssrn.6309551

Cited by: 0

References: 19

Fields of Study & Subjects

Advanced MEMS and NEMS Technologies Acoustic Wave Resonator Technologies 3D IC and TSV technologies

References 19