High strength, toughness, low thermal expansion, and environmental resistance epoxy resins for cryogenic applications, enhanced by dual rigid-flexible structures and dual dynamic bonds

SSRN Electronic Journal 2026 Preprint Open access

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Authors: Jie Zhao, Xupeng Li, Xiang Dong Luo, Weicheng Jiao, Yushan Wu, Chul B. Park, Peng Xu, Lichun Ma
DOI: 10.2139/ssrn.6309930
Cited by: 0
References: 24

Fields of Study & Subjects

Epoxy Resin Curing Processes Polymer Science and Applications Synthesis and properties of polymers

Publication details

Journal / source
SSRN Electronic Journal
Publication date
1 January 2026
Language
EN
Document type
Preprint