Neural network-accelerated multiscale dynamic stability analysis of TSV-based interposers in 3D integrated circuits

SSRN Electronic Journal 2026 Preprint Open access

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Authors: Qingya Li, Tengfei Mao, Juan Ma, Haochen Liu, Ye Yuan, Jian Liu, Leru Luo, Ming Liu

DOI: 10.2139/ssrn.6362501

Cited by: 0

References: 41

Fields of Study & Subjects

3D IC and TSV technologies Composite Structure Analysis and Optimization Nonlocal and gradient elasticity in micro/nano structures

References 41