Effect of TLPD bonding temperature on microstructure, grain morphology and shear strength of Cu/Sn/Ni micro-joints

SSRN Electronic Journal 2026 Preprint Open access

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Authors: Yanqing Lai, Kun Jiang, Tao Yang, Donghui Zheng, Guoxin Li, Shuai Zhang, Tao Xu, Ning Zhao
DOI: 10.2139/ssrn.6365610
Cited by: 0
References: 22

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies Advanced Welding Techniques Analysis 3D IC and TSV technologies

Publication details

Journal / source
SSRN Electronic Journal
Publication date
1 January 2026
Language
EN
Document type
Preprint