Study on Bonding Performance of Palladium-Coated Copper Wires with Different Palladium Layer Thicknesses

SSRN Electronic Journal 2026 Preprint Open access

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Authors: Jingguang Yao, Hongliang Zhou, J. Cao, Xinyan Gao, Sujuan Zhong, Xian Dong, Junhua Guo, Baoan Wu, Xiaoning Xu, Ziming Wang, John Persic
DOI: 10.2139/ssrn.6386070
Cited by: 0
References: 13

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies 3D IC and TSV technologies Copper Interconnects and Reliability

Publication details

Journal / source
SSRN Electronic Journal
Publication date
1 January 2026
Language
EN
Document type
Preprint